Plasmonic nanoparticle-based epoxy photocuring: A deeper look

Simple item page
dc.citation.firstpage14
dc.citation.journalTitleMaterials Today
dc.citation.lastpage20
dc.citation.volumeNumber27
dc.contributor.authorRoberts, Adam T.
dc.contributor.authorYang, Jian
dc.contributor.authorReish, Matthew E.
dc.contributor.authorAlabastri, Alessandro
dc.contributor.authorHalas, Naomi J.
dc.contributor.authorNordlander, Peter
dc.contributor.authorEveritt, Henry O.
dc.date.accessioned2019-08-28T16:10:12Z
dc.date.available2019-08-28T16:10:12Z
dc.date.issued2019
dc.description.abstractMany epoxyﾠadhesivesﾠrequire high temperatures to bondﾠcomposite materials. However, oven heating severely restricts what may be attached or enclosed within composite material-based structures and greatly limits the possibilities for repair. Inspired by initial reports of photothermal epoxy curing usingﾠplasmonicnanoparticles, we examine how laser-illuminated Au nanoparticles embedded within high-temperature epoxy films convert the conventional thermal curing process into a photothermally driven one. Our theoretical investigations reveal that plasmonic nanoparticle-based epoxy photocuring proceeds through a four-stage process: a rapid, plasmon-induced temperature increase, a slow localizedﾠinitializationﾠof the curing chemistry that increases theﾠoptical absorptionﾠof the epoxy film, a subsequent temperature increase as the epoxy absorbs theﾠlaser radiationﾠdirectly, and a final stage that completes theﾠchemical transformationﾠof the epoxy film to its cured state. Our experimental studies validate this model, and also reveal that highly local photocuring can create a stronger bond between composite materials than thermal curing without nanoparticles, at times even stronger than the composite material itself, substantially reducing the time needed for the curing process. Our findings support key advances in our understanding of this approach to the rapid, highly efficient bonding and repair of composite materials.
dc.identifier.citationRoberts, Adam T., Yang, Jian, Reish, Matthew E., et al.. "Plasmonic nanoparticle-based epoxy photocuring: A deeper look." <i>Materials Today,</i> 27, (2019) Elsevier: 14-20. https://doi.org/10.1016/j.mattod.2018.09.005.
dc.identifier.doihttps://doi.org/10.1016/j.mattod.2018.09.005
dc.identifier.urihttps://hdl.handle.net/1911/107369
dc.language.isoeng
dc.publisherElsevier
dc.rightsThis is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.titlePlasmonic nanoparticle-based epoxy photocuring: A deeper look
dc.typeJournal article
dc.type.dcmiText
dc.type.publicationpublisher version
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
epoxy-photocuring.pdf
Size:
1.17 MB
Format:
Adobe Portable Document Format
Description:
Download
Collections
Faculty Publications
Chemistry Publications
ECE Publications
Physics and Astronomy Publications