3D Covalent Organic Frameworks with Interpenetrated pcb Topology Based on 8-Connected Cubic Nodes

dc.citation.firstpage5728
dc.citation.issueNumber13
dc.citation.journalTitleJournal of the American Chemical Society
dc.citation.lastpage5733
dc.citation.volumeNumber144
dc.contributor.authorShan, Zhen
dc.contributor.authorWu, Miaomiao
dc.contributor.authorZhu, Dongyang
dc.contributor.authorWu, Xiaowei
dc.contributor.authorZhang, Kan
dc.contributor.authorVerduzco, Rafael
dc.contributor.authorZhang, Gen
dc.date.accessioned2022-05-25T14:49:59Z
dc.date.available2022-05-25T14:49:59Z
dc.date.issued2022
dc.description.abstractThe connectivity of building units for 3D covalent organic frameworks (COFs) has long been primarily 4 and 6, which have severely curtailed the structural diversity of 3D COFs. Here we demonstrate the successful design and synthesis of a porphyrin based, 8-connected building block with cubic configuration, which could be further reticulated into an unprecedented interpenetrated pcb topology by imine condensation with linear amine monomers. This study presents the first case of high-connectivity building units bearing 8-connected cubic nodes, thus greatly enriching the topological possibilities of 3D COFs.
dc.identifier.citationShan, Zhen, Wu, Miaomiao, Zhu, Dongyang, et al.. "3D Covalent Organic Frameworks with Interpenetrated pcb Topology Based on 8-Connected Cubic Nodes." <i>Journal of the American Chemical Society,</i> 144, no. 13 (2022) American Chemical Society: 5728-5733. https://doi.org/10.1021/jacs.2c01037.
dc.identifier.doihttps://doi.org/10.1021/jacs.2c01037
dc.identifier.urihttps://hdl.handle.net/1911/112400
dc.language.isoeng
dc.publisherAmerican Chemical Society
dc.rightsThis is an author's peer-reviewed final manuscript, as accepted by the publisher. The published article is copyrighted by the American Chemical Society.
dc.title3D Covalent Organic Frameworks with Interpenetrated pcb Topology Based on 8-Connected Cubic Nodes
dc.typeJournal article
dc.type.dcmiText
dc.type.publicationpost-print
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