Understanding the effect of carbon nanotube functionalization on copper electrodeposition
dc.citation.firstpage | 731 | en_US |
dc.citation.issueNumber | 8 | en_US |
dc.citation.journalTitle | Journal of Applied Electrochemistry | en_US |
dc.citation.lastpage | 741 | en_US |
dc.citation.volumeNumber | 49 | en_US |
dc.contributor.author | Kazimierska, Ewa | en_US |
dc.contributor.author | Andreoli, Enrico | en_US |
dc.contributor.author | Barron, Andrew R. | en_US |
dc.date.accessioned | 2019-11-22T16:19:51Z | en_US |
dc.date.available | 2019-11-22T16:19:51Z | en_US |
dc.date.issued | 2019 | en_US |
dc.description.abstract | The dynamics of electrochemical deposition and dissolution of copper in the presence of functionalized multiwalled carbon nanotubes in solution has been studied in detail using an electrochemical quartz crystal microbalance. Results demonstrate the central role of carbon nanotube functionalization on the values of mass and current densities of copper deposition. Amine functionalization increases competitive hydrogen evolution without significantly affecting the total amount of deposited copper, whereas carboxylic functionalization clearly enhances the deposition of larger amounts of smoother copper deposits. Molar mass analysis of deposited species reveals interactions of carbon nanotubes with the electrode surface dependent on the type of functionalization. The effect of carbon nanotube functionalization should be closely considered in the development of electrochemical strategies for the integration of carbon nanotubes in metallic copper. | en_US |
dc.identifier.citation | Kazimierska, Ewa, Andreoli, Enrico and Barron, Andrew R.. "Understanding the effect of carbon nanotube functionalization on copper electrodeposition." <i>Journal of Applied Electrochemistry,</i> 49, no. 8 (2019) Springer: 731-741. https://doi.org/10.1007/s10800-019-01318-x. | en_US |
dc.identifier.digital | Kazimierska2019 | en_US |
dc.identifier.doi | https://doi.org/10.1007/s10800-019-01318-x | en_US |
dc.identifier.uri | https://hdl.handle.net/1911/107709 | en_US |
dc.language.iso | eng | en_US |
dc.publisher | Springer | en_US |
dc.rights | This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. | en_US |
dc.rights.uri | http://creativecommons.org/licenses/by/4.0/), | en_US |
dc.subject.keyword | Copper | en_US |
dc.subject.keyword | Carbon nanotubes | en_US |
dc.subject.keyword | Composite | en_US |
dc.subject.keyword | Functionalization | en_US |
dc.subject.keyword | Electrodeposition | en_US |
dc.title | Understanding the effect of carbon nanotube functionalization on copper electrodeposition | en_US |
dc.type | Journal article | en_US |
dc.type.dcmi | Text | en_US |
dc.type.publication | publisher version | en_US |
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