Micromechanical devices for materials characterization

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dc.contributor.assigneeRice Universityen_US
dc.contributor.publisherUnited States Patent and Trademark Officeen_US
dc.creatorLou, Junen_US
dc.creatorGanesan, Yogeeswaranen_US
dc.creatorLu, Yangen_US
dc.creatorPeng, Chengen_US
dc.date.accessioned2015-05-04T19:05:58Z
dc.date.available2015-05-04T19:05:58Z
dc.date.filed2009-10-28en_US
dc.date.issued2011-11-15en_US
dc.description.abstractThe present disclosure describes micromechanical devices and methods for using such devices for characterizing a material's strength. The micromechanical devices include an anchor pad, a top shuttle platform, a nanoindenter in movable contact with the top shuttle platform and at least two sample stage shuttles. The nanoindenter applies a compression force to the top shuttle platform, and the at least two sample stage shuttles move apart in response to the compression force. Each of the at least two sample stage shuttles is connected to the top shuttle platform and to the anchor pad by at least one inclined beam. Methods for using the devices include connecting a sample between the at least two sample stage shuttles and applying a compression force to the top shuttle platform. Application of the compression force to the top shuttle platform results in a tensile force being applied to the sample. Measuring a tip displacement of the nanoindenter is correlated with the sample's strength. Illustrative materials that can be studied using the micromechanical devices include, for example, nanotubes, nanowires, nanorings, nanocomposites and protein fibrils.en_US
dc.digitization.specificationsThis patent information was downloaded from the US Patent and Trademark website (http://www.uspto.gov/) as image-PDFs. The PDFs were OCRed for access purposes.en_US
dc.format.extent22 ppen_US
dc.identifier.citationLou, Jun, Ganesan, Yogeeswaran, Lu, Yang and Peng, Cheng, "Micromechanical devices for materials characterization." Patent US8058613B2. issued 2011-11-15. Retrieved from https://hdl.handle.net/1911/80071.
dc.identifier.patentIDUS8058613B2en_US
dc.identifier.urihttps://hdl.handle.net/1911/80071
dc.language.isoengen_US
dc.titleMicromechanical devices for materials characterizationen_US
dc.typeUtility patenten_US
dc.type.dcmiTexten_US
dc.type.genrepatentsen_US
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