Methods for producing submicron metal line and island arrays

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dc.contributor.assigneeRice Universityen_US
dc.contributor.publisherUnited States Patent and Trademark Officeen_US
dc.creatorMoran, Cristin Erinen_US
dc.creatorRadloff, Corey J.en_US
dc.creatorHalas, Nancy J.en_US
dc.date.accessioned2015-05-04T19:05:37Z
dc.date.available2015-05-04T19:05:37Z
dc.date.filed2003-04-01en_US
dc.date.issued2005-04-05en_US
dc.description.abstractThis process results in directed electroless plating of the metal to form discrete metal structures over the entire surface. Because the surface is pre-patterned with passivated regions inert to metal deposition, the metal is directed only to the unstamped regions. This allows the formation of unconnected metal structures without any chemical etching steps. These metallic arrays are varied in size, separation and shape by using gratings of different periodicities and blaze angles as the stamp templates. A variety of well-defined geometric patterns have been fabricated and imaged using scanning probe, scanning electron, and optical microscopies.en_US
dc.digitization.specificationsThis patent information was downloaded from the US Patent and Trademark website (http://www.uspto.gov/) as image-PDFs. The PDFs were OCRed for access purposes.en_US
dc.format.extent10 ppen_US
dc.identifier.citationMoran, Cristin Erin, Radloff, Corey J. and Halas, Nancy J., "Methods for producing submicron metal line and island arrays." Patent US6875475B2. issued 2005-04-05. Retrieved from https://hdl.handle.net/1911/79886.
dc.identifier.patentIDUS6875475B2en_US
dc.identifier.urihttps://hdl.handle.net/1911/79886
dc.language.isoengen_US
dc.titleMethods for producing submicron metal line and island arraysen_US
dc.typeUtility patenten_US
dc.type.dcmiTexten_US
dc.type.genrepatentsen_US
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