Hot embossed polyethylene through-hole chips for bead-based microfluidicdevices

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dc.citation.firstpage653en_US
dc.citation.journalTitleBiosensors and Bioelectronicsen_US
dc.citation.lastpage660en_US
dc.citation.volumeNumber42en_US
dc.contributor.authorChou, Jieen_US
dc.contributor.authorDu, Nanen_US
dc.contributor.authorOu, Tinaen_US
dc.contributor.authorFloriano, Pierre N.en_US
dc.contributor.authorChristodoulides, Nicolaosen_US
dc.contributor.authorMcDevitt, John T.en_US
dc.contributor.orgRice Quantum Instituteen_US
dc.date.accessioned2014-12-15T20:35:11Zen_US
dc.date.available2014-12-15T20:35:11Zen_US
dc.date.issued2013en_US
dc.description.abstractOver the past decade, there has been a growth of interest in the translation of microfluidic systems into real-world clinical practice, especially for use in point-of-care or near patient settings. While initial fabrication advances in microfluidics involved mainly the etching of silicon and glass, the economics of scaling of these materials is not amendable for point-of-care usage where single-test applications forces cost considerations to be kept low and throughput high. As such, a materials base more consistent with point-of-care needs is required. In this manuscript, the fabrication of a hot embossed, through-hole low-density polyethylene ensembles derived from an anisotropically etched silicon wafer is discussed. This semi-opaque polymer that can be easily sterilized and recycled provides low background noise for fluorescence measurements and yields more affordable cost than other thermoplastics commonly used for microfluidic applications such as cyclic olefin copolymer (COC). To fabrication through-hole microchips from this alternative material for microfluidics, a fabrication technique that uses a high-temperature, high-pressure resistant mold is described. This aluminum-based epoxy mold, serving as the positive master mold for embossing, is casted over etched arrays of pyramidal pits in a silicon wafer. Methods of surface treatment of the wafer prior to casting and PDMS casting of the epoxy are discussed to preserve the silicon wafer for future use. Changes in the thickness of polyethylene are observed for varying embossing temperatures. The methodology described herein can quickly fabricate 20 disposable, single use chips in less than 30 minutes with the ability to scale up 4x by using multiple molds simultaneously. When coupled as a platform supporting porous bead sensors, as in the recently developed Programmable Bio-Nano-Chip, this bead chip system can achieve limits of detection, for the cardiac biomarker C-reactive protein, of 0.3 ng/mL, thereby demonstrating the approach is compatible with high performance, real-world clinical measurements in the context of point-of-care testing.en_US
dc.identifier.citationChou, Jie, Du, Nan, Ou, Tina, et al.. "Hot embossed polyethylene through-hole chips for bead-based microfluidicdevices." <i>Biosensors and Bioelectronics,</i> 42, (2013) Elsevier: 653-660. http://dx.doi.org/10.1016/j.bios.2012.09.056.en_US
dc.identifier.doihttp://dx.doi.org/10.1016/j.bios.2012.09.056en_US
dc.identifier.urihttps://hdl.handle.net/1911/78760en_US
dc.language.isoengen_US
dc.publisherElsevieren_US
dc.rightsThis is an author's peer-reviewed final manuscript, as accepted by the publisher. The published article is copyrighted by Elsevier.en_US
dc.subject.keywordhot embossingen_US
dc.subject.keywordthermoplasticsen_US
dc.subject.keywordpoint-of-careen_US
dc.subject.keywordbeadsen_US
dc.subject.keywordimmunoassaysen_US
dc.subject.keywordmicrofluidicsen_US
dc.titleHot embossed polyethylene through-hole chips for bead-based microfluidicdevicesen_US
dc.typeJournal articleen_US
dc.type.dcmiTexten_US
dc.type.publicationpost-printen_US
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