Single crystals of molybdenum were deformed in tension at 195°K, 273°K, 373°K and 473°K. The influence of deformation temperature and intermediate annealing treatments at 473°K and 422°K on the electrical resistivity was investigated. All resistivity measurements were made at 4.2°K. The results indicated that: (1) Point defects are created during deformation at 195°K and 273°K; (2) The rate with respect to strain at which these defects are produced is an inverse function of the deformation temperature; (3) Some or all of the point defects are mobile at 422°K and either diffuse together or to dislocations, and (4) This movement of the point defects does not affect the flow stress. No definite conclusion was reached on the dislocation model responsible for the results.