Submicron Optical Lithography Based on Interferometric Phase Shifting

dc.citation.conferenceDate1995en_US
dc.citation.conferenceNameNSF Design, Manufacturing and Industrial Innovation Grantees Conferenceen_US
dc.citation.firstpage395en_US
dc.citation.lastpage396en_US
dc.citation.locationSan Diego, CAen_US
dc.contributor.authorCavallaro, Joseph R.en_US
dc.contributor.authorTittel, Frank K.en_US
dc.contributor.authorWilson, William L. Jr.en_US
dc.contributor.orgCenter for Multimedia Communicationen_US
dc.date.accessioned2012-06-21T21:10:08Zen_US
dc.date.available2012-06-21T21:10:08Zen_US
dc.date.issued1995-01-01en_US
dc.description.abstractOne of the most critical processing steps in the fabrication of integrated circuits is microlithography. The design of high density DRAMs requires the accurate patterning of submicron structures. The manufacturability of VLSI components can be greatly improved through the integration of computer aided design and simulation software with an advanced interferometric optical system. In a new approach, a typical line and space pattern with features as fine as 0.3 um has been produced using a mask that has both transmitting areas and reflective areas and 355 nm laser illumination.en_US
dc.description.sponsorshipNational Science Foundationen_US
dc.identifier.citationJ. R. Cavallaro, F. K. Tittel and W. L. J. Wilson, "Submicron Optical Lithography Based on Interferometric Phase Shifting," 1995.en_US
dc.identifier.urihttps://hdl.handle.net/1911/64289en_US
dc.language.isoengen_US
dc.publisherSME Pressen_US
dc.titleSubmicron Optical Lithography Based on Interferometric Phase Shiftingen_US
dc.typeConference paperen_US
dc.type.dcmiTexten_US
dc.type.dcmiTexten_US
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