Browsing by Author "Gowenlock, Cathren E."
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Item Electrodeposition of Cu-SWCNT Composites(MDPI, 2019) Raja, Pavan M. V.; Esquenazi, Gibran L.; Gowenlock, Cathren E.; Jones, Daniel R.; Li, Jianhua; Brinson, Bruce; Barron, Andrew R.Single walled carbon nanotubes (SWCNTs) are used as a component of a plating solution of CuSO4 for direct current electrodeposition of Cu–SWCNT composites with varying nanotube proportions without the use of either a surfactant, a dispersing agent, or functionalization of the SWCNTs. The Cu–SWCNT composites are characterized by scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDX), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and Raman spectroscopy. The composites are comprised of metallic Cu and SWCNTs with minor oxide impurities, as well as the residual (Fe) catalyst from the unpurified SWCNTs, in addition to displaying nanotube-mediated morphological differences. EDX analysis of carbon (wt%) is close to quantitative with respect to the wt% of SWCNTs added to the electrolysis solution. The presence of SWCNTs decreases the oxidation of the copper, as well as changing the identity of the oxide from CuO, for electrolysis of Cu, to Cu2O. Hard adherent Cu–SWCNT coatings are prepared by the addition of Cu powder to the electrolysis solution. The approach described in this paper will enable controlled synthesis of metal-nanomaterial composites that can potentially be processed further into high ampacity electrical conductors.Item Surface-initiated growth of copper using isonicotinic acid-functionalized aluminum oxide surfaces(Springer, 2016) Gowenlock, Cathren E.; Gomez, Virginia; McGettrick, James D.; Andreoli, Enrico; Barron, Andrew R.Isonicotinate self-assembled monolayers (SAM) were prepared on alumina surfaces (A) using isonicotinic acid (iNA). These functionalized layers (iNA-A) were used for the seeded growth of copper films (Cu-iNA-A) by hydrazine hydrate-initiated electroless deposition. The films were characterized by scanning electron microscopy (SEM), electron-dispersive X-ray spectroscopy, atomic force microscopy, X-ray photoelectron spectroscopy, X-ray diffraction, and advancing contact angle measurements. The films are Cu0 but with surface oxidation, and show a faceted morphology, which is more textured (Rq = 460 ± 90 nm) compared to the SAM (Rq = 2.8 ± 0.5 nm). In contrast, growth of copper films by SnCl2/PdCl2 catalyzed electroless deposition, using formaldehyde (CH2O) as the reducing agent, shows a nodular morphology on top of a relatively smooth surface. No copper films are observed in the absence of the isonicotinate SAM. The binding of Cu2+ to the iNA is proposed to facilitate reduction to Cu0 and create the seed for subsequent growth. The films show good adhesion to the functionalized surface.