Gowenlock, Cathren E.Gomez, VirginiaMcGettrick, James D.Andreoli, EnricoBarron, Andrew R.2016-11-222016-11-222016Gowenlock, Cathren E., Gomez, Virginia, McGettrick, James D., et al.. "Surface-initiated growth of copper using isonicotinic acid-functionalized aluminum oxide surfaces." <i>Journal of Coatings Technology and Research,</i> (2016) Springer: http://dx.doi.org/10.1007/s11998-016-9842-0.https://hdl.handle.net/1911/92718Isonicotinate self-assembled monolayers (SAM) were prepared on alumina surfaces (A) using isonicotinic acid (iNA). These functionalized layers (iNA-A) were used for the seeded growth of copper films (Cu-iNA-A) by hydrazine hydrate-initiated electroless deposition. The films were characterized by scanning electron microscopy (SEM), electron-dispersive X-ray spectroscopy, atomic force microscopy, X-ray photoelectron spectroscopy, X-ray diffraction, and advancing contact angle measurements. The films are Cu0 but with surface oxidation, and show a faceted morphology, which is more textured (Rq = 460 ± 90 nm) compared to the SAM (Rq = 2.8 ± 0.5 nm). In contrast, growth of copper films by SnCl2/PdCl2 catalyzed electroless deposition, using formaldehyde (CH2O) as the reducing agent, shows a nodular morphology on top of a relatively smooth surface. No copper films are observed in the absence of the isonicotinate SAM. The binding of Cu2+ to the iNA is proposed to facilitate reduction to Cu0 and create the seed for subsequent growth. The films show good adhesion to the functionalized surface.engThis article is distributed under the terms of the Creative Commons Attribution 4.0 International License, which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.Journal articlecopperisonicotinic acidaluminum oxidethin filmelectroless depositionhttp://dx.doi.org/10.1007/s11998-016-9842-0