Mulla, RafiqKiani, SajadWhite, Alvin OrbaekDunnill, Charles W.Barron, Andrew R.2023-05-022023-05-022023Mulla, Rafiq, Kiani, Sajad, White, Alvin Orbaek, et al.. "Enhanced thermoelectricity in Bi-sprayed bismuth sulphide particles." <i>Materials Science in Semiconductor Processing,</i> 162, (2023) Elsevier: https://doi.org/10.1016/j.mssp.2023.107528.https://hdl.handle.net/1911/114856Bismuth sulphide (Bi2S3), an n-type semiconductor that critically demonstrates the Seebeck effect with Seebeck coefficients of about 300 μVK−1. However, its poor electrical conductivity makes it unsuitable for thermoelectric applications. In this study, we present a facile preparation method for fabricating Bi-sprayed Bi2S3 particles that alters their thermoelectric properties. Samples were created with differing Bi concentrations into the Bi2S3 compound to test for enhanced thermoelectric properties of the resulting Bi/Bi2S3 composites. The incorporation of excess Bi into Bi2S3 significantly improves the compound's electrical conductivity and optimises overall thermoelectric performance. The electrical conductivity of the Bi/Bi2S3 composites improved from 6.5 Scm−1 (for pristine Bi2S3) to 154 Scm−1 (for highest Bi added Bi2S3). Although the Seebeck coefficient of samples decreased with Bi incorporation, a high power factor (∼390 μWm−1K−2) has been achieved for an optimised composition of the composite. Incorporation of metallic Bi has led to an increase in the thermal conductivity of the samples, but the increase is not significant for the optimised composition of the composites where a high thermoelectric performance has been observed. Therefore, enhanced power factor and moderate thermal conductivity have resulted in a peak ZT value of 0.11 at room temperature. The strategy proposed here improves the thermoelectricity in Bi2S3 and shows excellent potential for developing better-performing thermoelectric compounds with excess elemental contents.engThis is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).Journal article1-s2-0-S1369800123002214-mainhttps://doi.org/10.1016/j.mssp.2023.107528