2015-05-042015-05-042011-11-15Lou, Jun, Ganesan, Yogeeswaran, Lu, Yang and Peng, Cheng, "Micromechanical devices for materials characterization." Patent US8058613B2. issued 2011-11-15. Retrieved from https://hdl.handle.net/1911/80071.https://hdl.handle.net/1911/80071The present disclosure describes micromechanical devices and methods for using such devices for characterizing a material's strength. The micromechanical devices include an anchor pad, a top shuttle platform, a nanoindenter in movable contact with the top shuttle platform and at least two sample stage shuttles. The nanoindenter applies a compression force to the top shuttle platform, and the at least two sample stage shuttles move apart in response to the compression force. Each of the at least two sample stage shuttles is connected to the top shuttle platform and to the anchor pad by at least one inclined beam. Methods for using the devices include connecting a sample between the at least two sample stage shuttles and applying a compression force to the top shuttle platform. Application of the compression force to the top shuttle platform results in a tensile force being applied to the sample. Measuring a tip displacement of the nanoindenter is correlated with the sample's strength. Illustrative materials that can be studied using the micromechanical devices include, for example, nanotubes, nanowires, nanorings, nanocomposites and protein fibrils.22 ppengUtility patentUS8058613B2