2015-05-042015-05-042005-04-05Moran, Cristin Erin, Radloff, Corey J. and Halas, Nancy J., "Methods for producing submicron metal line and island arrays." Patent US6875475B2. issued 2005-04-05. Retrieved from https://hdl.handle.net/1911/79886.https://hdl.handle.net/1911/79886This process results in directed electroless plating of the metal to form discrete metal structures over the entire surface. Because the surface is pre-patterned with passivated regions inert to metal deposition, the metal is directed only to the unstamped regions. This allows the formation of unconnected metal structures without any chemical etching steps. These metallic arrays are varied in size, separation and shape by using gratings of different periodicities and blaze angles as the stamp templates. A variety of well-defined geometric patterns have been fabricated and imaged using scanning probe, scanning electron, and optical microscopies.10 ppengUtility patentUS6875475B2