2021-03-022021-03-022020-10-20Tour, James M., Yang, Yang and Ruan, Gedeng, "Production and use of flexible conductive films and inorganic layers in electronic devices." Patent US10811166B2. issued 2020-10-20. Retrieved from <a href="https://hdl.handle.net/1911/110117">https://hdl.handle.net/1911/110117</a>.https://hdl.handle.net/1911/110117Embodiments of the present disclosure pertain to methods of making conductive films by associating an inorganic composition with an insulating substrate, and forming a porous inorganic layer from the inorganic composition on the insulating substrate. The inorganic layer may include a nanoporous metal layer, such as nickel fluoride. The methods of the present disclosure may also include a step of incorporating the conductive films into an electronic device. The methods of the present disclosure may also include a step of associating the conductive films with a solid electrolyte prior to its incorporation into an electronic device. The methods of the present disclosure may also include a step of separating the inorganic layer from the conductive film to form a freestanding inorganic layer. Further embodiments of the present disclosure pertain to the conductive films and freestanding inorganic layers.37engUtility patentUS10811166B2